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SUBMIT AN ABSTRACT
SEMI, the FlexTech Group, and the FLEX 2020 Executive Committee invite you to submit an abstract for one or more of the following areas:
TechTALKS Demonstration and Presentation
The 2019 Chinese Flexible and Printed Electronics Symposium (FLEX China 2019)
Dates: 23-25 October 2019, Venue: Suzhou Industry Park
FLEX China 2019 will continue to serve as a platform for exchange of information and progress in the field of flexible ...
Join NextFlex on Tuesday, August 6 th for the NextFlex Symposium: Monitoring People Inside and Out for Health and High Performance! Human Monitoring Systems have been an active area of manufacturing capability development and technology demonstrations ...
2019 IEEE International Electron Devices Meeting
December 7th – 11th, 2019
Hilton San Francisco Union Square
San Francisco, California
Focused Call for Papers
IEDM is pleased to announce increased technical focus in the area of: Sensors, MEMS, ...
The Convergent Future: Industries-wide Disruption through Flexible Hybrid Electronics
FLEX Southeast Asia 2019 presents a fascinating view of the convergence of semiconductor and organic electronics manufacturing and applications.
The conference ...